Thin Wafer Processing And Dicing Equipment Market Growth | 2022-27
Market Overview:
In 2021, the market for thin wafer processing and dicing equipment was valued at USD 601.6 million. By 2027, it is anticipated to reach USD 872.6 million, growing at a CAGR of 6.35%. (2021–2026). Electronic packaging is now useful in a wide range of applications as a result of the increasing efforts to make it highly resourceful due to the enormous demand for electronic components as a result of increased usage. These elements are propelling the market for semiconductor and IC packaging.
Scope of the Report:
Thin wafers are required due to the need for miniaturisation in order to create compact, high-performing, and affordable device configurations. For applications like memory and power devices, the majority of them even fell below 100 m or even 50 m. Thin wafers are those with a thickness of less than 390 m. After a semiconductor wafer has been processed, the die is separated from the wafer using a process known as wafer dicing.
Wafer thickness, wafer size (less than 4 inches, 5 inches, and 6 inches, 8 inches, and 12 inches), geography, and application are the segments used to categorise the thin wafer processing and dicing equipment. Application segments include memory and logic, MEMS devices, power devices, CMOS image sensors, and RFID.
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